C&H Technology CM75TX-24S - Manual (Page 5)

CM75TX-24S
Six IGBTMOD™ NX-S Series Module
75 Amperes/1200 Volts
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
4 06/11 Rev. 2
Electrical Characteristics, T
j
= 25°C unless otherwise specified (continued)
NTC Thermistor Part
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Zero Power Resistance R
25
T
C
= 25°C *2 4.85 5.00 5.15 kΩ
Deviation of Resistance ∆R/R T
C
= 100°C, R
100
= 493Ω -7.3 — +7.8 %
B Constant B
(25/50)
Approximate by Equation *6 — 3375 — K
Power Dissipation P
25
T
C
= 25°C *2 — — 10 mW
Thermal Resistance Characteristics
Thermal Resistance, Junction to Case *2 R
th(j-c)
Q IGBT Part, Per 1/6 Module — — 0.25 K/W
Thermal Resistance, Junction to Case *2 R
th(j-c)
D FWDi Part, Per 1/6 Module — — 0.40 K/W
Contact Thermal Resistance, R
th(c-f)
Thermal Grease Applied, — 0.015 — K/W
Case to Heatsink *2 Per 1 Module *7
Mechanical Characteristics
Mounting Torque M
s
Mounting to Heatsink, M5 Screw 22 27 31 in-lb
Weight m — 300 — Grams
Creepage Distance d
s
Terminal to Terminal 10.28 — — mm
Terminal to Baseplate 14.27 — — mm
Clearance d
a
Terminal to Terminal 10.28 — — mm
Terminal to Baseplate 12.33 — — mm
Flatness of Baseplate e
c
On Centerline X, Y *8 ±0 — ±100 µm
Recommended Operating Conditons, T
a
= 25°C
DC Supply Voltage V
CC
Applied Across P-N/P1-N1 Terminals — 600 850 Volts
Gate-Emitter Drive Voltage V
GE(on)
Applied Across 13.5 15.0 16.5 Volts
G*P-Es*P/G*N-Es*N Terminals
External Gate Resistance R
G
Per Switch 8.2 — 82 Ω
*2 Case temperature (T C ) and heatsink temperature (T s ) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*6 B (25/50) = In(
R 25
)/(
1
–
1
)
R 50 T 25 T 50
R 25 ; Resistance at Absolute Temperature T 25 [K]; T 25 = 25 [°C] + 273.15 = 298.15 [K]
R 50 ; Resistance at Absolute Temperature T 50 [K]; T 50 = 50 [°C] + 273.15 = 323.15 [K]
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
– :
CONC
A
VE
+ :
CONVEX
– : CONCAVE
X
Y
+ : CONVEX
MOUNTING
SIDE
MOUNTING SIDE
MOUNTING SIDE
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
53
54
55
56
57
58
59
60
61
30
29
28
27
26
25
24
23
52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31
0 0
21.6 19.9
28.4
LABEL SIDE
Each mark points to the center position of each chip.
Tr*P / Tr*N: IGBT Di*P / Di*N: FWDi Th: NTC Thermistor
20.6 0 33.1 51
.6
64.1 82.6 96.1
30.0
24.1
104.5
Di
UP
Di
VP
Di
WP
Tr
UP
Tr
VP
Tr
WP
Di
UN
Di
VN
Di
WN
Tr
UN
Tr
VN
Tr
WN
Th