Vishay high power products, Thermal - mechanical characteristics – C&H Technology GB200TS60NPbF User Manual

Page 4

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Document Number: 94503

For technical questions, contact: [email protected]

www.vishay.com

Revision: 07-May-08

3

GB200TS60NPbF

INT-A-PAK "Half-Bridge"

(Ultrafast Speed IGBT), 209 A

Vishay High Power Products

Fig. 1 - Typical IGBT Output Characteristics

T

J

= 25 °C, t

p

= 500 µs

Fig. 2 - Typical IGBT Output Characteristics

T

J

= 125 °C, t

p

= 500 µs

Fig. 3 - Typical Transfer Characteristics

V

CE

= 20 V, t

p

= 500 µs

Fig. 4 - Typical Collector to Emitter Voltage vs.

Junction Temperature

THERMAL - MECHANICAL CHARACTERISTICS

PARAMETER SYMBOL

MIN.

TYP.

MAX.

UNITS

Operating junction and storage temperature range

T

J

, T

Stg

- 40

-

150

°C

Junction to case per leg

IGBT

R

thJC

-

0.13

0.16

°C/W

Diode

-

0.19

0.32

Case to sink per module

R

thCS

-

0.1

-

Mounting torque

case to heatsink

-

-

4

Nm

case to terminal 1, 2, 3

-

-

3

Weight

-

185

-

g

I

cE

(A)

V

CE

(V)

0

1

2

3

4

0

50

100

150

200

250

300

Vge = 9V

Vge = 12V

Vge = 15V

Vge = 18V

I

cE

(A)

0

1

2

3

4

5

0

50

100

150

200

250

300

Vge = 9V

Vge = 18V
Vge = 15V
Vge = 12V

V

CE

(V)

I

cE

(A)

V

GE

(V)

0

1

2

3

4

5

6

7

8

9

0

50

100

150

200

250

300

Tj = 25°C

Tj = 125°C

0

40

80

120

160

1

1.5

2

2.5

3

3.5

Ic = 50A

Ic = 100A

Ic = 200A

T

J

, Junction Temperature (°C)

V

CE

, Collector -to-Emitter Voltage (V)

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