Rainbow Electronics W25X64 - Manual (Page 2)

W25X16, W25X32, W25X64
- 2 -
Table of Contents-
1. GENERAL DESCRIPTION ......................................................................................................... 4
2. FEATURES ................................................................................................................................. 4
3. PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
4. PIN CONFIGURATION WSON 6X5-MM .................................................................................... 5
5. PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6
6. PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, AND WSON 6X5-MM ............................... 6
7. PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
8. PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
8.1 Package Types ............................................................................................................... 8
8.2 Chip Select (/CS) ............................................................................................................ 8
8.3 Serial Data Output (DO) ................................................................................................. 8
8.4 Write Protect (/WP)......................................................................................................... 8
8.5 HOLD (/HOLD) ............................................................................................................... 8
8.6 Serial Clock (CLK) .......................................................................................................... 8
8.7 Serial Data Input / Output (DIO) ..................................................................................... 8
9. BLOCK DIAGRAM ...................................................................................................................... 9
10. FUNCTIONAL DESCRIPTION ................................................................................................. 10
10.1 SPI OPERATIONS ....................................................................................................... 10
10.1.1 SPI Modes ....................................................................................................................10
10.1.2 Dual Output SPI............................................................................................................10
10.1.3 Hold Function ...............................................................................................................10
10.2 WRITE PROTECTION.................................................................................................. 11
10.2.1 Write Protect Features..................................................................................................11
11. CONTROL AND STATUS REGISTERS................................................................................... 12
11.1 STATUS REGISTER .................................................................................................... 12
11.1.1 BUSY............................................................................................................................12
11.1.2 Write Enable Latch (WEL) ............................................................................................12
11.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................12
11.1.4 Top/Bottom Block Protect (TB) .....................................................................................12
11.1.5 Reserved Bits ...............................................................................................................12
11.1.6 Status Register Protect (SRP) ......................................................................................13
11.1.7 Status Register Memory Protection ..............................................................................14
11.2 INSTRUCTIONS ........................................................................................................... 16
11.2.1 Manufacturer and Device Identification.........................................................................16
11.2.2 Instruction Set
(1)
...........................................................................................................17
11.2.3 Write Disable (04h) .......................................................................................................18