Rainbow Electronics W25X64 - Manual (Page 38)

W25X16, W25X32, W25X64
- 38 -
12.8 AC Electrical Characteristics ( cont’d)
SPEC
DESCRIPTION SYMBOL ALT
MIN TYP MAX
UNIT
/HOLD Active Setup Time relative to CLK t HLCH 5 ns
/HOLD Active Hold Time relative to CLK t CHHH 5 ns
/HOLD Not Active Setup Time relative to CLK t HHCH 5 ns
/HOLD Not Active Hold Time relative to CLK t CHHL 5 ns
/HOLD to Output Low-Z t HHQX (2) t LZ 7 ns
/HOLD to Output High-Z t HLQZ (2) t HZ 12 ns
Write Protect Setup Time Before /CS Low t WHSL (3) 20 ns
Write Protect Hold Time After /CS High t SHWL (3) 100 ns
/CS High to Power-down Mode t DP (2) 3 µs
/CS High to Standby Mode without Electronic
Signature Read t RES 1 (2) 3 µs
/CS High to Standby Mode with Electronic
Signature Read t RES 2 (2) 1.8 µs
Write Status Register Time t W 10 15 ms
Byte Program Time (First Byte) (5) t
BP1
100 150 µs
Additional Byte Program Time (After First Byte) (5) t
BP2
6 12 µs
Page Program Time t PP 1.5 3 ms
Sector Erase Time (4KB) t SE 150 300 ms
Block Erase Time (64KB) t BE 1 2 s
Chip Erase Time W25X16
Chip Erase Time W25X32
Chip Erase Time W25X64 t CE 15
25
35
40
80
160
s
s
s
Notes:
1. Clock high + Clock low must be less than or equal to 1/f C .
2. Value guaranteed by design and/or characterization, not 100% tested in production.
3. Only applicable as a constraint for a Write Status Register instruction when Sector Protect Bit is set to 1.
4. Commercial temperature only applies to Fast Read (F
R0
& F
R1
). Industrial temperature applies to all other parameters.
5. For multiple bytes after first byte within a page, t
BPN
= t
BP1 +
t
BP2 * N
(typical) and t
BPN
= t
BP1 +
t
BP2 * N
(max), where N
= number of bytes programmed.