Rainbow Electronics AT28C0101 - Manual (Page 13)

AT28C010 Mil
13
Packaging Information
1.68(42.7)
1.64(41.7)
PIN
1
.610(15.5)
.570(14.5)
.098(2.49)
MAX
.005(.127)
MIN
.060(1.52)
.015(.381)
.023(.584)
.014(.356)
.065(1.65)
.045(1.14)
0
15
REF
.620(15.7)
.590(15.0)
.700(17.8) MAX
.015(.381)
.008(.203)
.110(2.79)
.090(2.29)
.200(5.08)
.125(3.18)
SEATING
PLANE
.225(5.72)
MAX
1.500(38.10) REF
PIN #1 ID
.370(9.40)
.270(6.86)
.019(.482)
.015(.381)
.050(1.27) BSC
.045(1.14) MAX
.120(3.05)
.098(2.49)
.045(1.14)
.026(.660)
.072(1.82)
.030(0.76)
.408(10.4)
.355(9.02)
.006(.152)
.004(.101)
.488(12.4)
.472(12.0)
.829(21.1)
.811(20.6)
*Controlling dimension: millimeters *Controlling dimension: millimeters
32D6, 32-Lead, 0.600" Wide, Non-Windowed,
Ceramic Dual inline Package (Cerdip)
Dimensions in Inches and (Millimeters)
MIL-STD-1835 D-16 CONFIG A
32F, 32-Lead, Non-Windowed, Ceramic Bottom
Brazed Flat Package (Flatpack)
Dimensions in Inches and (Millimeters)
MIL-STD-1835 F-18 CONFIG B
JEDEC OUTLINE MO-115
32L, 32-Pad, Non-Windowed, Ceramic Leadless
Chip Carrier (LCC)
Dimensions in Inches and (Millimeters)*
MIL-STD-1835 C-12
44L, 44-Pad, Non-Windowed, Ceramic Leadless
Chip Carrier (LCC)
Dimensions in Inches and (Millimeters)*
MIL-STD-1835 C-5