Irlts2242pbf, Power mosfets – Rainbow Electronics IRLTS2242TRPBF User Manual

Page 5

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5

Fig 12. On-Resistance vs. Gate Voltage

Fig 13. Typical On-Resistance vs. Drain Current

Fig 14. Maximum Avalanche Energy vs. Drain Current

Fig 15

. Typical Power vs. Time

*

Reverse Polarity of D.U.T for P-Channel

P.W.

Period

di/dt

Diode Recovery

dv/dt

Ripple

 5%

Body Diode Forward Drop

Re-Applied

Voltage

Reverse

Recovery

Current

Body Diode Forward

Current

V

GS

=10V

V

DD

I

SD

Driver Gate Drive

D.U.T. I

SD

Waveform

D.U.T. V

DS

Waveform

Inductor Curent

D =

P.W.

Period

*

V

GS

= 5V for Logic Level Devices

*

Inductor Current

Circuit Layout Considerations

 Low Stray Inductance

Ground Plane

Low Leakage Inductance

Current Transformer

di/dt controlled by R

G

Driver same type as D.U.T.

I

SD

controlled by Duty Factor "D"

D.U.T. - Device Under Test

+

-

+

+

+

-

-

-

ƒ

„

‚

R

G

V

DD

D.U.T

*



Fig 16.

Diode Reverse Recovery Test Circuit for P-Channel HEXFET

®

Power MOSFETs

0

5

10

15

20

-VGS, Gate -to -Source Voltage (V)

0

10

20

30

40

50

60

70

R

D

S

(o

n)

,

D

ra

in

-t

o

-S

ou

rc

e

O

n

R

es

is

ta

nc

e

(m

)

ID = -6.9A

TJ = 25°C

TJ = 125°C

0

10

20

30

40

50

60

-ID, Drain Current (A)

0

50

100

150

200

250

300

350

400

450

R

D

S

(o

n)

,

D

ra

in

-t

o

-S

ou

rc

e

O

n

R

es

is

ta

nc

e

(m

)

Vgs = -4.5V

Vgs = -2.5V

25

50

75

100

125

150

Starting TJ , Junction Temperature (°C)

0

20

40

60

80

100

120

E

A

S

,

S

in

gl

e

P

ul

se

A

va

la

nc

he

E

ne

rg

y

(m

J)

ID

TOP -1.3A

-2.0A

BOTTOM -5.5A

1E-8

1E-7

1E-6

1E-5

1E-4

1E-3

Time (sec)

0

2000

4000

6000

8000

10000

12000

14000

16000

P

ow

er

(

W

)

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