Rainbow Electronics DS1486P User Manual
Page 13
DS1486/DS1486P
13 of 17
NOTES:
1.
WE
is high for a read cycle.
2.
OE
= V
IH
or V
IL
. If
OE
= V
IH
during write cycle, the output buffers remain in a high impedance state.
3. t
WP
is specified as the logical AND of the
CE
and
WE
. t
WP
is measured from the latter of
CE
or
WE
going low to the earlier of
CE
or
WE
going high.
4. t
DS
or t
DH
are measured from the earlier of
CE
or
WE
going high.
5. t
DH
is measured from
WE
going high. If
CE
is used to terminate the write cycle, then t
DH
= 20 ns for
-120 parts and t
DH
= -25 ns for -150 parts.
6. If the
CE
low transition occurs simultaneously with or later than the
WE
low transition in write cycle
1, the output buffers remain in a high impedance state during this period.
7. If the
CE
high transition occurs prior to or simultaneously with the
WE
high transition, the output
buffers remain in a high impedance state during this period.
8. If
WE
is low or the
WE
low transition occurs prior to or simultaneously with the
CE
low transition,
the output buffers remain in a high impedance state during this period.
9. Each DS1486 is marked with a four-digit date code AABB. AA designates the year of manufacture.
BB designates the week of manufacture. The expected t
DR
is defined for DIP Modules as starting at
the date of manufacture.
10. All voltages are referenced to ground.
11. Applies to both interrupt pins when the alarms are set to pulse.
12. Interrupt output occurs within 100 ns on the alarm condition existing.
13. Both
INTA
and
INTB
(INTB) are open drain outputs.
14. Real-Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering
tech-niques as long as temperature exposure to the lithium energy source contained within does not
exceed +85
°C. Post-solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“live - bug”).
b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To
remove the part, apply flux, heat the lead frame pad until the solder reflows and use a solder
wick to remove solder.