Rainbow Electronics DS1486P - Manual (Page 15)

DS1486/DS1486P
15 of 17
DS1486P
PKG INCHES
DIM MIN NOM MAX
A 0.920 0.925 0.930
B 0.980 0.985 0.990
C - - 0.080
D 0.052 0.055 0.058
E 0.048 0.050 0.052
F 0.015 0.020 0.025
G 0.025 0.027 0.030
NOTE:
For the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass though solder
reflow oriented with the label side up (“live - bug”).
b. Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3
(three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to remove
solder.