Rainbow Electronics AT17F080 - Manual (Page 12)

12
AT17F040/080
3039C–CNFG–11/02
Notes: 1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site, at
http://www.atmel.com/atmel/acrobat/doc0636.pdf.
2. Airflow = 0 ft/min.
Thermal Resistance Coefficients
(1)
Package Type AT17F040 AT17F080
8CN4 Leadless Array Package (LAP)
q
JC
[ °C/W] –
q
JA
[ °C/W] (2) –
20J Plastic Leaded Chip Carrier (PLCC)
q
JC
[ °C/W] –
q
JA
[ °C/W] (2) –
44A Thin Plastic Quad Flat Package (TQFP)
q
JC
[ °C/W] – 17
q
JA
[ °C/W] (2) – 62
44J Plastic Leaded Chip Carrier (PLCC)
q
JC
[ °C/W] – 15
q
JA
[ °C/W] (2) – 50