GE Industrial Solutions 12V AustinLynx 10A - Manual (Page 18)

GE
Data Sheet
12V AustinLynx TM 10A: Non-Isolated DC-DC Power Modules,Programmable
10Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 10A Output Current
May 8, 2013 ©2013 General Electric Company. All rights reserved. Page 18
Surface Mount Information
Pick and Place
The 12V Austin Lynx Programmable SMT modules use an
open frame construction and are designed for a fully
automated assembly process. The modules are fitted with a
label designed to provide a large surface area for pick and
place operations. The label meets all the requirements for
surface mount processing, as well as safety standards, and
is able to withstand reflow temperatures of up to 300
o C. The
label also carries product information such as product code,
serial number and the location of manufacture.
Figure 33. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style, vacuum
pressure and placement speed should be considered to
optimize this process. The minimum recommended nozzle
diameter for reliable operation is 6mm. The maximum nozzle
outer diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
Tin Lead Soldering
The Austin Lynx TM 12 V SMT power modules are lead free
modules and can be soldered either in a lead-free solder
process or in a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in order
to customize the solder reflow profile for each application
board assembly. The following instructions must be
observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235
o C.
Typically, the eutectic solder melts at 183 o C, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection
to ensure a reliable solder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For reliable
soldering the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
REF
LO
W
TE
MP
(°
C)
0
50
100
150
200
250
300
Preheat zo ne
max 4
o Cs -1
So ak zo ne
30-240s
Heat zo ne
max 4
o Cs -1
Peak Temp 235 o C
Coo ling
zone
1-4
o Cs -1
T
lim
above
205 o C
REFLOW TIME (S)
Figure 34. Reflow Profile for Tin/Lead (Sn/Pb) process.
MAX TEM
P
SO
LD
ER
(°
C)
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
Figure 35. Time Limit Curve Above 205 o C for Tin/Lead
(Sn/Pb) process.