GE Industrial Solutions EHHD036A0F HAMMERHEAD Series - Manual (Page 11)

GE
Datasheet
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 3.3V
dc
, 36A, 120W Output
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 11
Through-Hole Soldering Information
Lead-Free Soldering
The EHHD036A0F xx RoHS-compliant through-hole
products use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. They are designed to be processed
through single or dual wave soldering machines. The pins
have a RoHS-compliant finish that is compatible with both
Pb and Pb-free wave soldering processes. A maximum
preheat rate of 3
°C/s is suggested. The wave preheat
process should be such that the temperature of the power
module board is kept below 210
°C. For Pb solder, the
recommended pot temperature is 260 °C, while the Pb-free
solder pot is 270 °C max.
Paste-in-Hole Soldering
The EHHD036A0F xx module is compatible with reflow
paste-in-hole soldering processes shown in Figures 24-26.
Since the EHHD036A0F xxZ module is not packaged per J-
STD-033 Rev.A, the module must be baked prior to the
paste-in-hole reflow process. EHHD036A0F xx-HZ modules
are not compatible with paste-in-hole reflow soldering.
Please contact your GE Sales Representative for further
information.
Surface Mount Information
MSL Rating
The EHHD036A0F -SZ module has a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
provided for the EHHD036A0Axx-SZ modules. These sealed
packages should not be broken until time of use. Once the
original package is broken, the floor life of the product at
conditions of
≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf life
for dry packed SMT packages is a minimum of 12 months
from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity
.
Pick and Place
The EHHD036A0F modules use an open frame construction
and are designed for a fully automated assembly process.
The modules are fitted with a label designed to provide a
large surface area for pick and place operations. The label
meets all the requirements for surface mount processing, as
well as safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries product
information such as product code, serial number and the
location of manufacture.
Figure 23. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
6mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
Tin Lead Soldering
The EHHD036A0F power modules are lead free modules
and can be soldered either in a lead-free solder process or
in a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions must
be observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235oC.
Typically, the eutectic solder melts at 183oC, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection
to ensure a reliablesolder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For reliable
soldering the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
Lead Free Soldering
The –Z version of the EHHD036A0F modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may
result in the failure of or cause damage to the modules and
can adversely affect long-term reliability.