GE Industrial Solutions EQW006 Series - Manual (Page 17)

Data Sheet
July 27, 2011
EQW006 Series, Eight Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
LINEAGE POWER 17
Surface Mount Information
Pick and Place
The SMT versions of the EQW series of DC-to-DC
power converters use an open-frame construction and
are designed for surface mount assembly within a
fully automated manufacturing process.
The EQW-S series modules are fitted with a label
designed to provide a large flat surface for pick and
placing. The label is located covering the center of
gravity of the power module. The label meets all the
requirements for surface-mount processing, as well
as meeting UL safety agency standards. The label will
withstand reflow temperatures up to 300
C. The label
also carries product information such as product
code, date and location of manufacture.
Figure 16. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place label is 9.15
mm (0.360 in) nominal with an RSS tolerance of +/-
0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with
conventional smt components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm. Oblong or oval nozzles
up to 11 x 9 mm may also be used within the space
available.
For further information please contact your local
Lineage Power Technical Sales Representative.
Tin Lead Soldering
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
The surface mountable modules in the EQW family
use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 17 shows the new CP
connector before and after reflow soldering onto the
end-board assembly.
EQW Board
Insulator
Solder Ball
End assembly PCB
Figure 17. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb-63/37) solder. The CP connector
design is able to compensate for large amounts of co-
planarity and still ensure a reliable SMT solder joint.
Typically, the eutectic solder melts at 183 o C, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering
the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
R
E
FLOW
TEMP (
C)
0
50
100
150
200
250
300
Preheat zo ne
max 4
o Cs -1
So ak zo ne
30-240s
Heat zo ne
max 4
o Cs -1
Peak Temp 235 o C
Coo ling
zone
1-4
o Cs -1
T
lim
above
205 o C
REFLOW TIME (S)
Figure 18. Reflow Profile for Tin/Lead (Sn/Pb)
process.