GE Industrial Solutions ATM020A0X3-SR - Manual (Page 20)

Data Sheet
September 10, 2013 Austin SuperLynx II TM SMT Non-isolated Power Modules:
2.4 – 3.63Vdc input; 0.75Vdc to 2.0Vdc Output; 20A output current
LINEAGE POWER 20
Surface Mount Information (continued)
Lead Free Soldering
The SMT modules of the Austin SuperLynx II TM
families are lead-free (Pb-free) and RoHS compliant
and are both forward and backward compatible in a
Pb-free and a SnPb soldering process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 38.
Storage and Handling
The Austin SuperLynx II TM modules have a MSL
rating of 2a. The recommended storage environment
and handling procedures for moisture-sensitive
surface mount packages is detailed in J-STD-033
Rev. A (Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These
sealed packages should not be broken until time of
use. Once the original package is broken, the floor
life of the product at conditions of
≤ 30°C and 60%
relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages will be a minimum of 12 months from the
bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning
Application Note
(AN04-001).
0
50
100
150
200
250
300
Reflow Time (in seconds)
Re
fl
o
w
T
e
m
p
(
° C
)
Peak Temp 245° C
Heating Zone
1° C / second
Cooling Zone
4° C / second
* Min. Time Above 235° C
15 seconds
* Time Above 217° C
60 seconds
Per J-STD-020 Rev. C
Figure 30. Recommended linear reflow profile
using Sn/Ag/Cu solder.