GE Industrial Solutions Austin Minilynx SMT - Manual (Page 19)

Data Sheet
September 10, 2013 Austin MiniLynx TM SMT Non-isolated Power Modules:
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 3A output current
LINEAGE POWER 19
Surface Mount Information (continued)
Lead Free Soldering
The –Z version Austin MiniLynx SMT modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 39.
MSL Rating
The Austin MiniLynx TM SMT modules have a MSL
rating of 2a.
Storage and Handling
The Austin MiniLynx TM modules have a MSL rating of
1. The recommended storage environment and
handling procedures for moisture-sensitive surface
mount packages is detailed in J-STD-033 Rev. A
(Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These
sealed packages should not be broken until time of
use. Once the original package is broken, the floor
life of the product at conditions of
≤ 30°C and 60%
relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages will be a minimum of 12 months from the
bag seal date, when stored at the following conditions:
< 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
efl
ow
T
em
p
(°
C
)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 39. Recommended linear reflow profile
using Sn/Ag/Cu solder.