GE Industrial Solutions 2A PicoTLynx - Manual (Page 23)

GE
Data Sheet
2A PicoTLynx TM : Non-Isolated DC-DC Power Modules
3Vdc –14Vdc input; 0.6Vdc to 5.5Vdc output; 2A Output Current
February 26, 2013 ©2013 General Electric Company. All rights reserved. Page 23
Surface Mount Information
Pick and Place
The 12V PicoTLynx TM 2A modules use an open frame
construction and are designed for a fully automated assembly
process. The modules are fitted with a label designed to provide
a large surface area for pick and place operations. The label
meets all the requirements for surface mount processing, as
well as safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries product
information such as product code, serial number and the
location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by using open
frame construction. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be considered to
optimize this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the bottom
side of a customer board. If such an assembly is attempted,
components may fall off the module during the second reflow
process. If assembly on the bottom side is planned, please
contact GE Critical Power for special manufacturing process
instructions.
Only ruggedized (-D version) modules with additional epoxy will
work with a customer’s first side assembly. For other versions,
first side assembly should be avoided
Lead Free Soldering
The 12V PicoTLynx TM 2A modules are lead-free (Pb-free) and
RoHS compliant and fully compatible in a Pb-free soldering
process. Failure to observe the instructions below may result in
the failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification procedures.
This standard provides a recommended forced-air-
convection reflow profile based on the volume and
thickness of the package (table 4-2). The suggested Pb-
free solder paste is Sn/Ag/Cu (SAC). A 6 mil thick stencil is
recommended.
For questions regarding Land grid array(LGA) soldering, solder
volume; please contact GE Critical Power for special
manufacturing process instructions.
The recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Fig. 61.
Soldering outside of the recommended profile
requires testing to verify results and performance.
MSL Rating
The 12V PicoTLynx TM 2A modules have a MSL rating of
2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB)
with desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be broken
until time of use. Once the original package is broken,
the floor life of the product at conditions of
≤ 30°C and
60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40°
C, < 90% relative humidity.
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
efl
ow
T
em
p
(°
C
)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 61. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).