GE Industrial Solutions EHHD006A0B Hammerhead Series - Manual (Page 10)

GE Data Sheet
EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 12Vdc, 6.0A, 72W Output
July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 10
Thermal Considerations (continued)
OUT
PUT
CURR
ENT,
I O
(A
)
AMBIENT TEMEPERATURE, T
A
( o C )
Figure 18. Output Current Derating for the Module with
Heat plate; Airflow in the Transverse Direction from V
out
(-)
to V
out
(+);V
IN
=24V.
Please refer to the Application Note ‘Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules’ for a detailed discussion of thermal aspects
including maximum device temperatures.
Heat Transfer via Conduction
The module can also be used in a sealed environment with
cooling via conduction from the
module’s top surface through a gap pad material to a
cold wall, as shown in Figure 19. This capability is achieved
by insuring the top side component skyline profile achieves
no more than 1mm height difference between the tallest
and the shortest power train part that benefits from contact
with the gap pad material. The output current derating
versus cold wall temperature, when using a gap pad such as
Bergquist GP2500S20, is shown in Figure 20.
Figure 19. Cold Wall Mounting
OUTPUT C
U
RR
EN
T, I
O
(A)
COLDPLATE TEMEPERATURE, T
C
( o C)
Figure 20. Derated Output Current versus Cold Wall
Temperature with Local Ambient Temperature Around
Module at 85C; V
IN
=24V or 48V.
Through-Hole Soldering Information
Lead-Free Soldering
The EHHD006A0Bxx RoHS-compliant through-hole products
use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have a
RoHS-compliant finish that is compatible with both Pb and
Pb-free wave soldering processes. A maximum preheat rate
of 3C/s is suggested. The wave preheat process should be
such that the temperature of the power module board is
kept below 210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is 270C
max.
Paste-in-Hole Soldering
The EHHD006A0Bxx module is compatible with reflow
paste-in-hole soldering processes shown in Figures 23-25.
Since the EHHD006A0BxxZ module is not packaged per J-
STD-033 Rev.A, the module must be baked prior to the
paste-in-hole reflow process. EHHD006A0Bxx-HZ modules
are not compatible with paste-in-hole reflow soldering.
Please contact your GE Sales Representative for further
information.
Surface Mount Information
MSL Rating
The EHHD006A0B-SZ module has a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
provided for the EHHD006A0Bxx-SZ modules. These sealed
packages should not be broken until time of use. Once the
original package is broken, the floor life of the product at
conditions of  30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf life
for dry packed SMT packages is a minimum of 12 months
from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity
.
Pick and Place
The EHHD006A0Bxx-S modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface
mount processing, as well as safety standards, and is able
to withstand reflow temperatures of up to 300 o C. The label
also carries product information such as product code,
serial number and the location of manufacture.