GE Industrial Solutions EHHD006A0B Hammerhead Series - Manual (Page 11)

GE Data Sheet
EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules
18-75Vdc Input; 12Vdc, 6.0A, 72W Output
July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 11
Surface Mount Information (continued)
Figure 21. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
6mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
Reflow Soldering Information
The surface mountable modules in the EHHD006A0Bxx-S
family use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 22 shows the new CP connector
before and after reflow soldering onto the end-board
assembly. The CP is constructed from a solid copper pin with
an integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag
3
/Cu (SAC)
solder for –Z codes.
EHHD Board
Insulator
Solder Ball
End assembly PCB
Figure 22. Column Pin Connector Before and After Reflow
Soldering.
The CP connector design is able to compensate for large
amounts of planarity and still ensure a reliable SMT solder
joint. Typically, the eutectic solder melts at 183°C (Sn/Pb
solder) or 217-218°C (SAC solder), wets the land, and
subsequently wicks the device connection. Sufficient time
must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of SMT
reflow technologies currently used in the industry. These
surface mount power modules can be reliably soldered
using natural forced convection, IR (radiant infrared), or a
combination of convection/IR. The following instructions
must be observed when SMT soldering these units. Failure to
observe these instructions may result in the failure of or
cause damage to the modules, and can adversely affect
long-term reliability.
Tin Lead Soldering
The EHHD006A0Bxx-S power modules are lead free modules
and can be soldered either in a lead-free solder process or
in a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions must
be observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.
In a conventional Tin/Lead (Sn/Pb) solder process, peak
reflow temperatures are limited to less than 235°C.
Typically, the eutectic solder melts at 183°C, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection
to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These surface
mount power modules can be reliably soldered using
natural forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering, the
solder reflow profile should be established by accurately
measuring the modules CP connector temperatures.
Lead Free Soldering
The –Z version of the EHHD006A0B modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may
result in the failure of or cause damage to the modules and
can adversely affect long-term reliability.
REFL
O
W
TE
MP
(
C)
REFLOW TIME (S)
Figure 23. Reflow Profile for Tin/Lead (Sn/Pb) process.
0
50
100
150
200
250
300
P reheat zo ne
max 4
o Cs -1
Soak zone
30-240s
Heat zo ne
max 4
o Cs -1
P eak Temp 235 o C
Co oling
zone
1-4
o Cs -1
T
lim
above
205 o C