GE Industrial Solutions ESTW015A0A Barracuda Series - Manual (Page 12)

GE Data Sheet
ESTW015A0A Barracuda™ Series; DC-DC Converter Power Modules
36-75Vdc Input; 5.0Vdc, 15A, 75W Output
March 28, 2013 ©2012 General Electric Company. All rights reserved. Page 12
Pb-free Reflow Profile
Power Systems will comply with J-STD-015 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 28.
Figure 24. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to GE Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Re
fl
o
w
T
em
p
(
°C)
He ating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone