GE Industrial Solutions ESTW015A0A Barracuda Series - Manual (Page 9)

GE Data Sheet
ESTW015A0A Barracuda™ Series; DC-DC Converter Power Modules
36-75Vdc Input; 5.0Vdc, 15A, 75W Output
March 28, 2013 ©2012 General Electric Company. All rights reserved. Page 9
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The thermal
data presented here is based on physical measurements
taken in a wind tunnel.
The thermal reference points, T
ref
, used in the specifications
for open frame modules is shown in Figure 13. For reliable
operation these temperatures should not exceed 125 O C.
Figure 13. T
ref
Temperature Measurement Locations for
Open Frame Module.
The thermal reference point, T
ref
, used in the specifications
for modules with heatplate is shown in Figure 14. For
reliable operation this temperature should not exceed 105
O C.
Figure 14. T
ref
Temperature Measurement Location for
Module with Heatplate.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (T
A
)
for natural convection and up to 3m/s (600 ft./min) forced
airflow are shown in Figures 16 - 21.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of thermal
aspects including maximum device temperatures.
Figure 15. Thermal Resistance for the Open Frame
Module; Airflow in the Transverse Direction from V
out
(-) to
V
out
(+); V
IN
=48V, V
O
=5.0V.
OU
TPUT
CURRENT,
I O
(A
)
AMBIENT TEMEPERATURE, T
A
( o C )
Figure 16. Output Current Derating for the Open Frame
Module; Airflow in the Transverse Direction from V
out
(-) to
V
out
(+); V
IN
=48V, V
O
=5.0V.
OUT
PUT
CURRENT
, I
O
(A
)
AMBIENT TEMEPERATURE, T
A
( o C )
Figure 17. Output Current Derating for the Module with
Heatplate; Airflow in the Transverse Direction from V
out
(-)
to V
out
(+);V
IN
=48V, V
O
=5.0V.
Heat Transfer via Conduction
The module can also be used in a sealed environment with
cooling via conduction from the
module’s top surface through a gap pad material to a
cold wall, as shown in Figure 22. This capability is achieved
by insuring the top side component skyline profile achieves
no more than 1mm height difference between the tallest
and the shortest power train part that benefits from contact
with the gap pad material. The output current derating
versus cold wall temperature, when using a gap pad such as
Bergquist GP2500S20, is shown in Figure 23.
AIRFLOW
AIRFLOW