Operating and package characteristics – Diodes 74AUP1G02 User Manual

Page 7

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74AUP1G02

Document number: DS35146 Rev. 2- 2

7 of 14

www.diodes.com

July 2013

© Diodes Incorporated

74AUP1G02


Operating and Package Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Parameter

Test

Conditions

V

CC

Typ Unit

C

pd

Power Dissipation
Capacitance

f = 1MHz

No Load

0.8V 6.8

pF

1.2V ± 0.1V

6.7

1.5V ± 0.1V

6.6

1.8V ± 0.15V

6.2

2.5V ± 0.2V

6.5

3.3V ± 0.3V

6.4

C

i

Input Capacitance

V

i

= V

CC

or GND

0V or 3.3V

1.5

pF

θ

JA

Thermal Resistance
Junction-to-Ambient

SOT353

(Note 6)

371

°C/W

X2-DFN0808-4

430

X2-DFN1010-6

445

X2-DFN1409-6

470

X2-DFN1410-6

460

θ

JC

Thermal Resistance
Junction-to-Case

SOT353

(Note 6

143

°C/W

X2-DFN0808-4

240

X2-DFN1010-6

250

X2-DFN1409-6

275

X2-DFN1410-6

265

Note:

6. Test condition for , SOT353, X2-DFN0808-4:, X2-DFN1010-6 X2-DFN1409-6 and X2-DFN1410-6: Device mounted on FR-4 substrate PC board,

2oz copper, with minimum recommended pad layout.



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