Dmn3032le new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMN3032LE User Manual

Page 2: Electrical characteristics, Dmn3032le

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DMN3032LE

Document number: DS36695 Rev. 2 - 2

2 of 6

www.diodes.com

May 2014

© Diodes Incorporated

DMN3032LE

NEW PROD

UC

T



Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

±20

V

Continuous Drain Current (Note 5) V

GS

= 10V

T

A

= +25°C

T

A

= +70°C

I

D

5.6
4.1

A

T

C

= +25°C

T

C

= +70°C

I

D

15.4
12.1

A

Maximum Continuous Body Diode Forward Current (Note 5)

I

S

1.5 A

Pulsed Drain Current (10μs pulse, duty cycle = 1%)

I

DM

25 A



Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 5)

T

A

= +25°C

P

D

1.8

W

T

A

= +70°C

1.1

Thermal Resistance, Junction to Ambient (Note 5)

R

θJA

69 °C/W

Total Power Dissipation (Note 5)

P

D

14 W

Thermal Resistance, Junction to Case (Note 5)

R

θJC

8.7 °C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

30

— V

V

GS

= 0V, I

D

= 250µA

Zero Gate Voltage Drain Current

I

DSS

— — 1 µA

V

DS

= 30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

— —

±100 nA

V

GS

=

±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

1 — 2 V

V

DS

= V

GS

, I

D

= 250µA

Static Drain-Source On-Resistance

R

DS (ON)

22 29

mΩ

V

GS

= 10V, I

D

= 3.2A

27 35

V

GS

= 4.5V, I

D

= 2.8A

Forward Transfer Admittance

|Y

fs

|

7 — S

V

DS

= 5V, I

D

= 5.8A

Diode Forward Voltage

V

SD

0.7 1.5 V

V

GS

= 0V, I

S

= 1A

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

— 498 —

pF

V

DS

= 15V, V

GS

= 0V

f = 1MHz

Output Capacitance

C

oss

— 52 —

Reverse Transfer Capacitance

C

rss

— 45 —

Gate Resistnace

R

g

— 2.2 — Ω

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge

Q

g

— 11.3 —

nC

V

DS

= 15V, V

GS

= 10V, I

D

= 5.8A

Gate-Source Charge

Q

gs

— 1.4 —

Gate-Drain Charge

Q

gd

— 2.1 —

Turn-On Delay Time

t

D(on)

— 2.3 —

ns

V

DS

= 15V, V

GS

= 10V,

R

L

= 2.6

Ω, R

G

= 3

Ω

Turn-On Rise Time

t

r

— 3.9 —

Turn-Off Delay Time

t

D(off)

— 10 —

Turn-Off Fall Time

t

f

— 1.9 —

Notes:

5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate
6 .Short duration pulse test used to minimize self-heating effect.

7. Guaranteed by design. Not subject to production testing.



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