Teledyne LeCroy PCI Express 3.0 Mid-Bus Probe User Manual

Page 5

Advertising
background image

Teledyne LeCroy

PCIe 3.0 Mid-Bus Probe Installation Guide

Version 1.2

5

for PCIe 3.0 (2.5, 5 and 8 GT/s data rates, also referred to as “Gen3”). The PCIe 3.0 mid-bus probe is for
use with the Summit T3-16 and Summit T3-8 analyzers, and is documented in this manual.

The PCIe 3.0 mid-bus probe, in a similar fashion to the PCIe 1.0a and PCIe 2.0 implementations that
preceded it, is available in two versions: a full-size probe and a half-size probe. The full-size probe for is
shown on page 6. It has a four-strand ribbon cable and a x16 connection header. A half-size probe has a
two strand ribbon cable and a x8 connection header.

The part numbers and components of the Teledyne LeCroy PCIe 3.0 mid-bus probe are as follows:

(1) PE058ACA-X PCIe 3.0 Mid-Bus Probe Kit, x8 Lane Width, Full-size Connector, which includes

• PE010UCA-X iPass Y-Cable
• PE055ACA-X PCIe 3.0 Mid-Bus Probe Pod

• PE057ACA-X PCIe 3.0 x8 Mid-bus Probe Cable

• PE009UCA-X Daisy Chain Clock Cable
• PE014UCA-X Reference Clock Cable

• PE047UIA-X Gen3 Mid-bus Probe Connector Full-size

(2) PE050ACA-X PCIe 3.0 Mid-Bus Probe Kit, x4 Lane Width, Half-size Module, which includes:

• PE010UCA-X iPass Y-Cable

• PE055ACA-X PCIe 3.0 x8 Mid-Bus Pod
• PE056ACA-X Mid-bus Probe Cable (x4)

• PE009UCA-X Daisy Chain Clock Cable

• PE014UCA-X Reference Clock Cable
• PE054UIA-X PCIe 3.0 Mid-bus Probe Connector Half-Size

PE058ACA-X PCIe 3.0 x8 Full-Size Probe Kit

x1

x2

x4

x8

x16

Uni

Bidir

Uni

Bidir

Uni

Bidir

Uni

Bidir

Uni

Bidir

*

*For bidirectional x16, two PE050ACA-X kits are required.

PE059ACA-X PCIe 3.0 x4 Half-Size Probe Kit

x1

x2

x4

x8

x16

Uni

Bidir

Uni

Bidir

Uni

Bidir

Uni

Bidir

Uni

Bidir

Advertising