Document Outline

• HP ProLiant ML350 G6 Server User Guide
• Abstract
• Notice
• Contents
• Component identification
  • Front panel components
  • Front panel LEDs and buttons
  • Rear panel components
  • Rear panel LEDs and buttons
  • System board components
    • System board LEDs
    • NMI functionality
    • System maintenance switch
  • SAS/SATA device numbers
  • SAS and SATA hard drive LEDs
  • SAS and SATA hard drive LED combinations
  • Battery pack LEDs
  • FBWC module LEDs
  • Fan locations and configurations
• Operations
  • Power up the server
  • Power down the server
  • Extend the server from the rack
  • Remove the server from the rack
  • Access the server rear panel (rack model)
  • Open or remove the tower bezel
  • Remove the access panel
  • Install the access panel
  • Remove the media bay blank
  • Remove the large redundant fan air baffle
  • Remove the DIMM baffle
  • Remove a fan blank
• Setup
  • Optional installation services
  • Optimum environment
    • Space and airflow requirements
    • Temperature requirements
    • Power requirements
    • Electrical grounding requirements
  • Rack planning resources
  • Rack warnings
  • Contents of the tower server shipping carton
  • Contents of the rack server shipping carton
  • Installing hardware options
  • Setting up a tower server
  • Installing the server into the rack
  • Powering up and configuring the server
  • Installing the operating system
  • Registering the server
• Hardware options installation
  • Introduction
  • Processor option
  • Memory options
    • Memory subsystem architecture
    • Single-, dual-, and quad-rank DIMMs
    • DIMM identification
    • Memory configurations
      • RDIMM maximum memory configurations
      • UDIMM maximum memory configurations
      • Low voltage DIMMs
      • Advanced ECC memory configuration
      • Mirrored memory configuration
      • Lockstep memory configuration
      • Online Spare memory configuration
    • General DIMM slot population guidelines
      • Advanced ECC population guidelines
        • Single-processor Advanced ECC population order
        • Multi-processor Advanced ECC population order
      • Mirrored Memory population guidelines
        • Single-processor Mirrored Memory population order
        • Multi-processor Mirrored Memory population order
      • Lockstep Memory population guidelines
        • Single-processor Lockstep population order
        • Multi-processor Lockstep population order
    • Installing DIMMs
  • SAS or SATA hard drive option
  • Hard drive cage options
    • Installing a hard drive expansion cage power cable
    • Eight-bay SFF drive cage option
    • Two-bay LFF drive cage option
  • Removable media device options
    • Identifying guide screws
    • Installing a half-height or full-height media device
    • Installing the full-height media device shipping screw
  • Redundant fan assembly option
  • Redundant hot-plug power supply option
    • Power supply configuration
    • Installing the redundant hot-plug power supply option
  • Expansion board options
    • Removing the expansion slot cover
    • Installing an expansion board
  • PCI-X expansion cage option
  • Battery-backed write cache option
  • FBWC module and capacitor pack option
  • 150W PCIe video/graphics controller power cable option
  • HP Trusted Platform Module option
    • Installing the Trusted Platform Module board
    • Retaining the recovery key/password
    • Enabling the Trusted Platform Module
  • Tower-to-rack conversion option
• Configuration and utilities
  • Configuration tools
    • SmartStart software
      • SmartStart Scripting Toolkit
      • Configuration Replication Utility
    • HP ROM-Based Setup Utility
      • Using RBSU
      • Auto-configuration process
      • Boot options
      • BIOS Serial Console
      • Configuring mirrored memory
      • Configuring online spare memory
      • Configuring lockstep memory
    • Array Configuration Utility
    • Option ROM Configuration for Arrays
    • Re-entering the server serial number and product ID
  • Management tools
    • Automatic Server Recovery
    • ROMPaq utility
    • Integrated Lights-Out 2 technology
    • Erase Utility
    • Redundant ROM support
      • Safety and security benefits
    • USB support and functionality
      • USB support
      • Internal USB functionality
      • External USB functionality
    • Internal SD support
  • Diagnostic tools
    • HP Insight Diagnostics
    • HP Insight Diagnostics survey functionality
    • Integrated Management Log
  • Remote support and analysis tools
    • HP Insight Remote Support software
  • Keeping the system current
    • Drivers
    • ProLiant Support Packs
    • Operating System Version Support
    • Change control and proactive notification
    • Care Pack
• Troubleshooting
  • Troubleshooting resources
  • Pre-diagnostic steps
    • Important safety information
      • Symbols on equipment
      • Warnings and cautions
    • Symptom information
    • Prepare the server for diagnosis
      • Performing processor procedures in the troubleshooting process
      • Breaking the server down to the minimum hardware configuration
  • Loose connections
  • Service notifications
  • Server health LEDs
  • Troubleshooting flowcharts
    • Start diagnosis flowchart
    • General diagnosis flowchart
    • Server power-on problems flowchart
    • POST problems flowchart
    • OS boot problems flowchart
    • Server fault indications flowchart
  • POST error messages and beep codes
• Battery replacement
• Regulatory compliance notices
  • Regulatory compliance identification numbers
  • Federal Communications Commission notice
    • FCC rating label
    • FCC Notice, Class A Equipment
    • FCC Notice, Class B Equipment
  • Declaration of conformity for products marked with the FCC logo, United States only
  • Modifications
  • Cables
  • Canadian notice (Avis Canadien)
  • European Union regulatory notice
  • Disposal of waste equipment by users in private households in the European Union
  • Japanese notice
  • BSMI notice
  • Korean notice
  • Chinese notice
  • Laser compliance
  • Battery replacement notice
  • Taiwan battery recycling notice
  • Power cord statement for Japan
  • Acoustics statement for Germany (Geräuschemission)
• Electrostatic discharge
  • Preventing electrostatic discharge
  • Grounding methods to prevent electrostatic discharge
• Server specifications
  • Environmental specifications
  • Mechanical specifications
  • Power supply specifications
• Technical support
  • Before you contact HP
  • HP contact information
  • Customer Self Repair
• Acronyms and abbreviations
• Index