Document Outline

• Abstract
• HP ProLiant BL660c Gen8 Server Blade User Guide
• Notice
• Contents
• Component identification
  • Front panel components
  • Front panel LEDs and buttons
  • Hot-plug drive LED definitions
  • System board components
    • Mezzanine connector definitions
    • DIMM slot locations
  • Tool locations
  • HP c-Class Blade SUV Cable
• Operations
  • Power up the server blade
  • Power down the server blade
  • Remove the server blade
  • Remove the access panel
  • Remove a drive
  • Removing DIMM baffles
    • Remove the center DIMM baffle
    • Remove the left DIMM baffle
    • Remove the right DIMM baffle
  • Remove the front panel/drive cage assembly
  • Remove the FBWC capacitor pack
• Setup
  • Installing an HP BladeSystem c-Class enclosure
    • Preparing the enclosure
      • Removing a c7000 device bay divider
      • Removing a c3000 device bay mini-divider or device bay divider
  • Installing interconnect modules
    • Interconnect bay numbering and device mapping
  • Connecting to the network
  • Installing server blade options
  • Installing a server blade
  • Assembling a full height blank
  • Completing the configuration
• Hardware options installation
  • Introduction
  • Drive option
  • Processor option
  • Memory options
    • HP SmartMemory
    • Memory subsystem architecture
    • Single-, dual-, and quad-rank DIMMs
    • DIMM identification
    • Memory configurations
      • Advanced ECC memory configuration
      • Online Spare memory configuration
      • Lockstep memory configuration
    • General DIMM slot population guidelines
      • Advanced ECC population guidelines
      • Online spare population
      • Lockstep Memory population guidelines
      • Population order
    • Installing a DIMM
  • FBWC capacitor pack options
  • Mezzanine card option
  • HP Trusted Platform Module option
    • Installing the Trusted Platform Module board
    • Retaining the recovery key/password
    • Enabling the Trusted Platform Module
• Cabling
  • Cabling resources
  • FBWC capacitor pack cabling
  • Using the HP c-Class Blade SUV Cable
  • Connecting locally to a server blade with video and USB devices
    • Accessing a server blade with local KVM
    • Accessing local media devices
• Software and configuration utilities
  • Server mode
  • HP product QuickSpecs
  • HP iLO Management
    • HP iLO
      • Active Health System
      • Integrated Management Log
    • Intelligent Provisioning
      • HP Insight Diagnostics
      • HP Insight Diagnostics survey functionality
      • Erase Utility
    • HP Insight Remote Support software
    • Scripting Toolkit for Windows and Linux
  • HP Service Pack for ProLiant
    • HP Smart Update Manager
  • HP ROM-Based Setup Utility
    • Using RBSU
    • Auto-configuration process
    • Boot options
    • Configuring AMP modes
    • Re-entering the server serial number and product ID
  • Utilities and features
    • Array Configuration Utility
    • Option ROM Configuration for Arrays
    • ROMPaq utility
    • Automatic Server Recovery
    • USB support
    • Redundant ROM support
      • Safety and security benefits
  • Keeping the system current
    • Drivers
    • Software and firmware
    • Version control
    • HP operating systems and virtualization software support for ProLiant servers
    • Change control and proactive notification
• Troubleshooting
  • Troubleshooting resources
• Battery replacement
• Regulatory compliance notices
  • Safety and regulatory compliance
  • Turkey RoHS material content declaration
  • Ukraine RoHS material content declaration
  • Warranty information
• Electrostatic discharge
  • Preventing electrostatic discharge
  • Grounding methods to prevent electrostatic discharge
• Specifications
  • Environmental specifications
  • Server blade specifications
• Support and other resources
  • Before you contact HP
  • HP contact information
  • Customer Self Repair
• Acronyms and abbreviations
• Documentation feedback
• Index