2 manufacturing options, Manufacturing options – chiliGREEN D945GBZ User Manual

Page 11

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Product Description

11

Table 1.

Feature Summary (continued)

Hardware Monitor
Subsystem

• Hardware monitoring and fan control ASIC
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan connectors
• Three fan sense inputs used to monitor fan activity
• Fan speed control

1.2.2 Manufacturing Options

Table 2 describes the manufacturing options. Not every manufacturing option is available in all
marketing channels. Please contact your Intel representative to determine which manufacturing
options are available to you.

Table 2.

Manufacturing Options

Audio Subsystem

Intel

®

High Definition Audio subsystem in one of the following configurations:

• 8-channel (7.1) audio subsystem with five analog audio outputs and one S/PDIF

optical digital audio output using the Sigmatel 9223 audio codec

• 6-channel (5.1) audio subsystem with three analog audio outputs using the

Sigmatel 9220 audio codec

IEEE-1394a
Interface

IEEE-1394a controller and three IEEE-1394a connectors (one back panel connector,
two front-panel connectors)

LAN subsystem

The board provides one of the following:
• Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the

Intel

®

82573E/82573V/82574V Gigabit Ethernet Controller

• 10/100 Mbits/sec LAN subsystem using the Intel

®

82562GX/82562GZ Platform

LAN Connect (PLC) device

SATA RAID

Intel

®

82801GR I/O Controller Hub (ICH7-R) for RAID support (levels 0,1, 0+1, and 5)

on the SATA interface

Trusted Platform
Module (TPM),
revision 1.2

A component that enhances platform security

For information about

Refer to

Available configurations for the board

Section 1.3, page 15

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