Availability, Printing parameters, Recommended reflow profile – HMC Electronics EM907 Kester Lead-Free Solder Paste User Manual
Page 2: Cleaning, Storage, handling, and shelf life, Health & safety
Application Notes
Availability:
Kester EM907 is available in the Sn96.5Ag3.0Cu0.5 and Sn96.5Ag3.5 alloys. Type 3 powder mesh is normally
recommended, but type 4 is available for fine pitch applications. EM907 is also compatible with other
SnAgCu alloys in a similar melting range to the listed alloys. For specific packaging information, see Kester's
Paste Packaging Chart for available sizes. The appropriate combination depends on process variables and
the specific application.
Printing Parameters:
Squeegee Blade
80 to 90 durometer polyurethane or stainless steel
Squeegee Speed
Capable to a maximum speed of 150 mm/sec (6 in/sec)
Stencil Material
Stainless Steel, Molybdenum, Nickel Plated, Brass
Temperature/Humidity
Optimal ranges are 21-25°C (70-77°F) and 35-65% RH
Recommended Reflow Profile:
Full convection reflow method is most com-
monly used to reflow the EM907 formula.
The recommended convection reflow profile
for EM907 made with either the Sn96.5Ag3.5
or SnAgCu alloys is shown here.
Cleaning:
EM907 is a no-clean formula. The residues do not need to be removed for typical applications. Although
EM907 is designed for no-clean applications, its residues can be easily removed using automated cleaning
equipment (in-line or batch) with a variety of readily available cleaning agents. Call Kester technical support
for details.
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,
reflow characteristics, and overall performance. EM907 should be stabilized at room temperature prior to
printing. EM907 should be kept at standard refrigeration temperatures, 0-10°C (32-50°F). Please contact
Kester if you require additional advice with regard to storage and handling of this material. Shelf life is 4
months from date of manufacture and held at 0-10°C (32-50°F).
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.
World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143-1341 USA
Phone: (+1) 630-616-4000 • Email: [email protected] • Website: www.kester.com
Kester Reflow Profile
SnAgCu Alloys
0
50
100
150
200
250
300
0
30
60
90
120
150
180
210
240
270
300
Time (sec.)
Temperature (C)
Pre-heating Zone
(2.0-4.0 min. max.)
Soaking Zone
(2.0 min.max.)
60-90 sec. typical
Reflow Zone
time above 217 C
(90 sec max)
60-75 sec. typical
Peak Temp.
235 - 255 C
<2.5 C/Sec
Asia Pacific Headquarters
500 Chai Chee Lane
Singapore 469024
(+65) 6449-1133
European Headquarters
Zum Plom 5
08541 Neuensalz
Germany
(+49) 3741 4233-0
Japanese Headquarters
20-11 Yokokawa 2-Chome
Sumida-Ku
Tokyo 130-0003 Japan
(+81) 3-3624-5351
The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the
potential hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used
in the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
EM907
Rev: 03Aug09
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
(800) 482-4440