Mag Layers USA MCI-2012 - Manual (Page 3)

(4) RELIABILITY TEST METHOD
Item
Solder ability It can be connected on the Apply cream solder to the test circuit board .
Recommendation soldering condition. It is mounted on the recommendation soldering condition.
Dip pads in flux and dip in solder pot ( 96.5 Sn/3.5 Ag
solder) at 260 °C ±5°C.
Terminal The terminal electrode and the ferrite Solder a chip to test substrate , and then laterally
strength must not be damaged. apply a load 0.5Kg in the arrow direction.
The terminal electrode and the ferrite Soldering a chip to a test substrate ,
must not be damaged. bend the substrate by 2mm and then return.
Strength on
pc board
bending
Dimensions in mm
Test board : Glass base epoxy multiplayer board pc board pattern.
PC board pattern : Recommended PC board pattern.
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Specifications Test conditions
MCI-2012-SERIES
MAG.LAYERS
100
length
Width side
45
45
40
20 10
R10
Force