Rockwell Automation 1746-NT4 SLC 500 Thermocouple/mV Input Module Installation Instructions - Manual (Page 7)

SLC™ 500 4-Channel Thermocouple/mV Input Module 7
Publication 1746-IN010D-EN-P - June 2004
Electrostatic Damage
Electrostatic discharge can damage semiconductor devices inside this module if you
touch backplane connector pins. Guard against electrostatic damage by observing
the following precautions.
• Wear an approved wrist strap grounding device when handling the module.
• Touch a grounded object to rid yourself of electrostatic charge before
handling the module.
• Handle the module from the front, away from the backplane connector. Do
not touch backplane connector pins.
• Keep the module in its static-shield bag when not in use, or during
shipment.
NT4 Power Requirements
The thermocouple module receives its power through the SLC 500 chassis
backplane from the fixed or modular +5V dc/+24V dc chassis power supply. The
maximum current drawn by the module is shown in the table below.
When you are using a modular system configuration, add the values shown in the
table above to the requirements of all other modules in the SLC chassis to prevent
overloading the chassis power supply.
When you are using a fixed system controller, refer to the important note on page 8
about module compatibility in a 2-slot fixed expansion chassis.
Modular Chassis Considerations
Place your thermocouple module in any slot of an SLC 500 modular, or modular
expansion chassis, except for the extreme left slot (slot 0) in the first chassis. This
slot is reserved for the processor or adapter modules.
ATTENTION
Electrostatic discharge can degrade performance or cause
permanent damage. Handle the module as stated below.
5V dc Amps 24V dc Amps
0.060 0.040