Capacitance [19, Thermal resistance [19, Capacitance – Cypress Perform CY7C1380F User Manual

Page 20: Thermal resistance

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CY7C1380D, CY7C1382D

CY7C1380F, CY7C1382F

Document #: 38-05543 Rev. *F

Page 20 of 34

Capacitance

[19]

Parameter

Description

Test Conditions

100 TQFP

Package

119 BGA

Package

165 FBGA

Package

Unit

C

IN

Input

Capacitance

T

A

= 25°C, f = 1 MHz,

V

DD

= 3.3V.

V

DDQ

= 2.5V

5

8

9

pF

C

CLK

Clock Input Capacitance

5

8

9

pF

C

IO

Input/Output Capacitance

5

8

9

pF

Thermal Resistance

[19]

Parameter

Description

Test Conditions

100 TQFP

Package

119 BGA

Package

165 FBGA

Package

Unit

Θ

JA

Thermal Resistance

(Junction to Ambient)

Test conditions follow standard

test methods and procedures

for measuring thermal

impedance, in accordance with

EIA/JESD51.

28.66

23.8

20.7

°C/W

Θ

JC

Thermal Resistance

(Junction to Case)

4.08

6.2

4.0

°C/W

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