Processor, System memory, Mobile intel® 945gse express chipset – Longshine D945GSEJT User Manual

Page 14: Mobile intel, 945gse express chipset

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Intel Desktop Board D945GSEJT Product Guide

14

Processor

Intel Desktop Board D945GSEJT includes an Intel Atom processor N270. The
processor is soldered to the Desktop Board and is not customer upgradeable.

NOTE

The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.

System Memory

NOTE

To be fully compliant with all applicable Intel

®

SDRAM memory specifications, the

board should be populated with an SO-DIMM that supports the Serial Presence Detect
(SPD) data structure. If the SO-DIMM does not support SPD, you will see a
notification to this effect on the screen at power up. The BIOS will attempt to
configure the memory controller for normal operation.
The Desktop Board has one 200-pin DDR2 SO-DIMM connector with gold-plated
contacts. It supports:
• 533 MHz unbuffered, non-registered DDR2 SO-DIMMs
• Serial Presence Detect (SPD) memory only
• Non-ECC memory
• Up to 2 GB of memory

Mobile Intel

®

945GSE Express Chipset

The Mobile Intel 945GSE Express Chipset consists of the following devices:
• Intel 82945GSE Express Chipset Graphics and Memory Controller Hub (GMCH) with

Direct Media Interface (DMI) interconnect

• Intel 82801GBM I/O Controller Hub (ICH7-M) with DMI
The GMCH component provides interfaces to the processor, memory, and the DMI
interconnect. This component also provides integrated graphics capabilities via the
Intel

®

Graphics Media Accelerator 950 (Intel

®

GMA 950).

The ICH7 is a centralized controller for the board’s I/O paths. For more information
about the Intel 945GSE Express Chipset, go to

http://www.intel.com/design/chipsets/embedded/945gse/

NOTE

The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the GMCH heatsink area for maximum heat
dissipation effectiveness.

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