Specifications, Physical characteristics, Power consumption – IBM CMX58886CX User Manual

Page 18: Operating conditions

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10

CMX58886CX cpuModule

BDM-610000050

Rev A

Specifications

Physical Characteristics

Dimensions: 117mm L x 97mm W x 15mm H (4.6"L x 3.8"W x 0.6"H)

Weight: Approximately 0.19 Kg (0.40 lbs.)

PCB: 14-layer, mixed surface-mount and thru-hole

Power Consumption

Exact power consumption depends on the actual application. Table 2 lists power consumption for typical
configurations and clock speeds.

Operating Conditions

Table 2

cpuModule Power Consumption

Module

Speed

RAM

Power, typ.

Power, Max.

CMX58886CX

1.0 GHz

256 or 512 MB

10.9 W

12.2 W

Table 3

Operating Conditions

Symbol

Parameter

Test Condition

Min.

Max.

V

CC5

5V Supply Voltage

4.75V

5.25V

V

CC3

3.3V Supply Voltage

3.1V

1

1. Because the cpuModule has an onboard +3.3V supply, an external +3.3V supply is not required.

However, if a +3.3 V supply is installed in the system to power PC/104-

Plus or PCI-104 expansion

boards, it will be monitored by the CPU at power up.

n/a

V

CC12

12V Supply Voltage

n/a

2

2. The 12V and -12V rails are not used by the cpuModule. They are only connected between the

bus connector and the power connector. Any requirements on these signals are driven by other
components in the system.

n/a

V

CC-12

-12V Supply Voltage

n/a

2

n/a

V

CCSTBY

5V Standby Voltage

3

3. 5V Standby is used to power the board when the main supply is turned off (power down modes

S3-S5). It is not required for board operation.

4.75V

5.25V

I

CCSTBY

5V Standby Current

3

-

500mA

Ta

Ambient Operating
Temperature

Standard

4

4. With proper cooling (See

Thermal Management on page 65)

-40C

+75C

Ta

Ambient Operating
Temperature

Extended

4

-40C

+85C

Ts

Storage Temperature

-40C

+85C

Rh

Humidity

Non-Condensing

0

90%

MTBF

Mean Time Before
Failure

23 C

110,000

hours

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