Figure 57. fc-pbga package (top and bottom views), Flip chip-plastic ball grid array package diagram, Fc-pbga package (top and bottom views) – Intel IXF1104 User Manual
Page 227: Intel, Top view bottom view
Intel
®
IXF1104 4-Port Gigabit Ethernet Media Access Controller
227
Datasheet
Document Number: 278757
Revision Number: 009
Revision Date: 27-Oct-2005
9.3.2
Flip Chip-Plastic Ball Grid Array Package Diagram
illustrates the FC-PBGA top and bottom package views and
PBGA mechanical specifications.
Note:
Please contact your field sales representative for more information on the FC-PBGA package.
Figure 57. FC-PBGA Package (Top and Bottom Views)
B5181-02
Basic
1.00 mm
Basic
1.00 mm
ł
eee (0.25)
łb
(0.55 min
0.75 max)
01
Terminal A01
Identifier
Lid
Seating Plane
Substrate
A B C
02
03
C A
M
B
ł
fff (0.10)
C
M
e
A
E
D
e
= No Ball
= Ball
Notes:
All dimensions are in millimeters.
Legend:
TOP VIEW
BOTTOM VIEW
C
aaa (0.20)
ccc (0.35)
//
C
A
(3.27 max)
A1
(0.40 min)
bbb (0.25)
//
C
25.0 Nom – 0.2
25.0 Nom – 0.2
All around
ddd (0.20)
B