Intel CORETM 2 DUO MOBILE 320028-001 User Manual
Intel Hardware
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Table of contents
Document Outline
- Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
- 1.0 Introduction
- 2.0 Package Information
- 3.0 Thermal Specifications
- 4.0 Mechanical Specifications
- 5.0 Thermal Solution Requirements
- 6.0 Reference Thermal Solutions
- 7.0 Thermal Metrology
- 8.0 Reliability Guidelines
- Appendix A Thermal Solution Component Suppliers
- Appendix B Mechanical Drawings
- Table 6. Mechanical Drawings
- Figure 15. AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2)
- Figure 16. AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2)
- Figure 17. AdvancedTCA* Reference Heatsink Assembly
- Figure 18. AdvancedTCA* Reference Heatsink
- Figure 19. CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2)
- Figure 20. CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2)
- Figure 21. CompactPCI* Reference Heatsink Assembly
- Figure 22. CompactPCI* Reference Heatsink
- Figure 23. 1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2)
- Figure 24. 1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2)
- Figure 25. 1U Reference Heatsink Assembly
- Figure 26. 1U Reference Heatsink
- Table 6. Mechanical Drawings