Document Outline

• Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
  • Contents
    • Figures
    • Tables
  • Revision History
• 1.0 Introduction
  • 1.1 Design Flow
    • Figure 1. Thermal Design Process
  • 1.2 Definition of Terms
    • Table 1. Definition of Terms (Sheet 1 of 2)
  • 1.3 Reference Documents
  • 1.4 Thermal Design Tool Availability
• 2.0 Package Information
• 3.0 Thermal Specifications
  • 3.1 Thermal Design Power
  • 3.2 Maximum Allowed Component Temperature
    • Table 2. Thermal Specifications for the Intel® Core™2 Duo processor
• 4.0 Mechanical Specifications
  • 4.1 Package Mechanical Requirements
    • 4.1.1 Die Pressure/Load Upper Limit
    • 4.1.2 Die Pressure/Load Lower Limit
  • 4.2 Package Keep Out Zones Requirements
  • 4.3 Board Level Keep Out Zone Requirements
    • Figure 2. Primary Side Keep Out Zone Requirements- Micro-FCPGA
    • Figure 3. Primary Side Keep Out Zone Requirements- Micro-FCBGA
    • Figure 4. Secondary Side Keep Out Zone Requirements
• 5.0 Thermal Solution Requirements
  • 5.1 Thermal Solution Characterization
    • Figure 5. Processor Thermal Characterization Parameter Relationships
    • 5.1.1 Calculating the Required Thermal Performance for the Intel® Core™2 Duo processor
      • Table 3. Required Heatsink Thermal Performance (YJA)
• 6.0 Reference Thermal Solutions
  • 6.1 ATCA Reference Thermal Solution
    • Figure 6. AdvancedTCA* Reference Heatsink Assembly
  • 6.2 Keep Out Zone Requirements
  • 6.3 Thermal Performance
    • Figure 7. AdvancedTCA* Heatsink Thermal Performance vs. Volumetric Airflow Rate
  • 6.4 1U+ Reference Heatsink
    • Figure 8. 1U Reference Heatsink Assembly
    • 6.4.1 Keep Out Zone Requirements
    • 6.4.2 Thermal Performance
      • Figure 9. 1U Heatsink Thermal Performance vs. Volumetric Airflow Rate
  • 6.5 Compact PCI Reference Heatsink
    • Figure 10. CompactPCI Reference Heatsink Assembly
    • 6.5.1 Keep Out Zone Requirements
    • 6.5.2 Thermal Performance
      • Figure 11. cPCI Reference Heatsink Thermal Performance vs. Volumetric Flow Rate
  • 6.6 Heatsink Fastener Assembly
  • 6.7 Thermal Interface Material (TIM)
  • 6.8 Heatsink Orientation
    • Figure 12. Heatsink Orientation Relative to Airflow Direction
• 7.0 Thermal Metrology
  • 7.1 Die Temperature Measurements
  • 7.2 Power Simulation Software
  • 7.3 Additional Thermal Features
  • 7.4 Local Ambient Temperature Measurement Guidelines
    • 7.4.1 Active Heatsink Measurements
    • 7.4.2 Passive Heatsink Measurements
      • Figure 13. Measuring TLA with an Active Heatsink
      • Figure 14. Measuring TLA with a Passive Heatsink
• 8.0 Reliability Guidelines
  • Table 4. Reliability Requirements
• Appendix A Thermal Solution Component Suppliers
  • Table 5. Reference Heatsink
• Appendix B Mechanical Drawings
  • Table 6. Mechanical Drawings
    • Figure 15. AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2)
    • Figure 16. AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2)
    • Figure 17. AdvancedTCA* Reference Heatsink Assembly
    • Figure 18. AdvancedTCA* Reference Heatsink
    • Figure 19. CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2)
    • Figure 20. CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2)
    • Figure 21. CompactPCI* Reference Heatsink Assembly
    • Figure 22. CompactPCI* Reference Heatsink
    • Figure 23. 1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2)
    • Figure 24. 1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2)
    • Figure 25. 1U Reference Heatsink Assembly
    • Figure 26. 1U Reference Heatsink