Intel CORETM 2 DUO MOBILE 320028-001 User Manual

Intel Hardware

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Table of contents

Document Outline

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
- Contents
  - Figures
  - Tables
- Revision History
1.0 Introduction
2.0 Package Information
3.0 Thermal Specifications
- 3.1 Thermal Design Power
- 3.2 Maximum Allowed Component Temperature
  - Table 2. Thermal Specifications for the Intel® Core™2 Duo processor
4.0 Mechanical Specifications
5.0 Thermal Solution Requirements
- 5.1 Thermal Solution Characterization
  - Figure 5. Processor Thermal Characterization Parameter Relationships
  - 5.1.1 Calculating the Required Thermal Performance for the Intel® Core™2 Duo processor
    - Table 3. Required Heatsink Thermal Performance (YJA)
6.0 Reference Thermal Solutions
7.0 Thermal Metrology
8.0 Reliability Guidelines
- Table 4. Reliability Requirements
Appendix A Thermal Solution Component Suppliers
- Table 5. Reference Heatsink
Appendix B Mechanical Drawings
- Table 6. Mechanical Drawings