Electrical diagrams, G-12, Pc board assembly-power – Lincoln Electric MULTI-WELD SVM151-A User Manual

Page 112: Multi-weld 350, Caution

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NOTE:

Lincoln Electric assumes no responsibility for liablilities resulting from board level troubleshooting. PC Board repairs will invalidate your factory warranty. Individual Printed Circuit Board Components are not available from Lincoln Electric. This information is pro-
vided for reference only. Lincoln Electric discourages board level troubleshooting and repair since it may compromise the quality of the design and may result in danger to the Machine Operator or Technician. Improper PC board repairs could result in damage to the
machine.

ELECTRICAL DIAGRAMS

G-12

MULTI-WELD 350

PC BOARD ASSEMBLY-POWER

CAD

9-17-99

RMT/

FULL

R

T

3-26-99

t

UNLESS OTHERWISE SPECIFIED TOLERANCE

ON HOLE SIZES PER E2056

ON 2 PLACE DECIMALS IS .02

WITH PUBLISHED STANDARDS.

ON 3 PLACE DECIMALS IS .002

ON ALL ANGLES IS .5 OF A DEGREE

MATERIAL TOLERANCE (" ") TO AGREE

THE LINCOLN ELECTRIC CO.

CLEVELAND, OHIO U.S.A.

EQUIP.

TYPE

SCALE

SUBJECT

DR

DATE

CHK

REF.

SUP'S'D'G

SHT.

NO.

THE LINCOLN ELECTRIC CO.

THIS SHEET CONTAINS PROPRIETARY INFORMATION

OWNED BY

AND IS

NOT TO BE REPRODUCED, DISCLOSED OR USED

THE LINCOLN ELECTRIC CO.

L

L

WITHOUT THE EXPRESS PERMISSION OF

11078-1

MAKE PER E1911

L11078-1B0

MANUFACTURED AS:

IDENTIFICATION CODE

}

}

CAPACITORS = MFD/VOLTS

RESISTORS = OHMS, 1/4 WATT (UNLESS OTHERWISE SPECIFIED)

ITEM

REQ'D

PART NO

IDENTIFICATION

ITEM

REQ'D

PART NO.

DESCRIPTION

1

1

11078-1

G3699-B

1

0

3.85~.04

40V DC B

US P

.C

. BO

ARD ASSEMBL

Y

MUL

TI-WELD 350

P.C. BOARD BLANK

0

4.50~.04

TEST PER E3862

.20

.20

3.65

4.30

ELECTRICITY. SEE E2454 BEFORE HANDLING.

CAUTION:

N.A. THIS DEVICE IS SUBJECT TO DAMAGE BY STATIC

N.A.

N.A.

N.A.

2

1

3

M16100-43
E2527

ELECTRONIC MODULE

N.B.

2

SCHEMATIC REFERENCE - M19330

XE-UF

POT PER E1911-E

100 g

EPOXY ENCAPSULATING RESIN

N.B. THESE HOLES TO BE KEPT FREE OF POTTING MATERIAL. (.50 DIA. MIN.)

POTTING MATERIAL BUILD UP.

N.C. COVER EXPOSED BOTTOM SURFACE OF ELECTRONIC MODULE TO AVOID

G-12

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