Philips TDA8559T User Manual

Page 36

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Philips Semiconductors

TDA8559T

Low-voltage stereo headphone amplifier

© Koninklijke Philips Electronics N.V. 2006.

All rights reserved.

For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: [email protected].

Date of release: 15 May 2006

Document identifier: TDA8559_3

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

20. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

6

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

7.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8

Functional description . . . . . . . . . . . . . . . . . . . 5

8.1

V/I converters . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.2

Output amplifiers. . . . . . . . . . . . . . . . . . . . . . . . 5

8.3

Buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.4

Dynamic quiescent controller . . . . . . . . . . . . . . 6

8.5

Stabilizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.6

Input logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.7

Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

9

Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 7

10

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10

11

Thermal characteristics. . . . . . . . . . . . . . . . . . 10

12

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10

13

Application information. . . . . . . . . . . . . . . . . . 11

13.1

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13.2

Heatsink design . . . . . . . . . . . . . . . . . . . . . . . 12

13.3

Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 12

13.4

Input configurations . . . . . . . . . . . . . . . . . . . . 13

13.5

Standby/mute . . . . . . . . . . . . . . . . . . . . . . . . . 14

13.6

Application 1: SE with loudspeaker capacitor. 14

13.7

Application 2: SE to buffer (without
loudspeaker capacitor) . . . . . . . . . . . . . . . . . 14

13.8

Application 3: Improved SE to buffer (without
loudspeaker capacitor) . . . . . . . . . . . . . . . . . . 14

13.9

Application 4: Bridge tied load mono amplifier 14

13.10

Application 5: Line driver application . . . . . . . 14

13.11

Application 6: Line driver application . . . . . . . 14

13.12

Application 7: Line driver application . . . . . . . 15

13.13

Application diagrams . . . . . . . . . . . . . . . . . . . 15

13.14

Printed-circuit board layout . . . . . . . . . . . . . . . 22

13.15

Response curves for low input mode . . . . . . . 22

13.16

Response curves for high input mode . . . . . . 26

14

Test information . . . . . . . . . . . . . . . . . . . . . . . . 29

14.1

Quality information . . . . . . . . . . . . . . . . . . . . . 29

15

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 30

16

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

16.1

Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

16.2

Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 31

16.3

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 31

16.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 32

16.5

Package related soldering information . . . . . . 32

17

Revision history . . . . . . . . . . . . . . . . . . . . . . . 34

18

Legal information . . . . . . . . . . . . . . . . . . . . . . 35

18.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 35

18.2

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

18.3

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 35

18.4

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 35

19

Contact information . . . . . . . . . . . . . . . . . . . . 35

20

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

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