Package outline – Philips BGY883 User Manual

Page 4

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2001 Oct 31

4

NXP Semiconductors

Product specification

860 MHz, 15 dB gain push-pull amplifier

BGY883

PACKAGE OUTLINE

UNIT

A2

max.

c

e

e1

q

Q

max.

q1

q2

U2

U1

W

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

20.8

9.5

0.51
0.38

0.25 27.2

2.04
2.54

13.75 2.54 5.08 12.7 8.8

4.15
3.85

2.4

38.1 25.4 10.2 4.2

44.75
44.25

8.2
7.8

0.25

0.1

3.8

b

F

p

6-32

UNC

y

w

0.7

x

S

DIMENSIONS (mm are the original dimensions)

SOT115J

0

5

10 mm

scale

A

max.

D

max.

L

min.

E

max.

Z

max.

Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads

SOT115J

D

U1

q

q2

q1

b

F

S

A

Z

p

E

A2

L

c

d

Q

U2

M

w

7

8

9

2

3

W

e

e1

5

p

1

d

x

M

B

y

M

B

B

04-02-04
10-06-18

y

M

B

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