Package outline, Sot89, Mmic wideband medium power amplifier bga6589 – Philips BGA6589 User Manual

Page 10

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2003 Sep 19

10

Philips Semiconductors

Product specification

MMIC wideband medium power amplifier

BGA6589

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

DIMENSIONS (mm are the original dimensions)

SOT89

TO-243

SC-62

97-02-28
99-09-13

w

M

e

1

e

E

HE

B

0

2

4 mm

scale

b3

b2

b1

c

D

L

A

Plastic surface mounted package; collector pad for good heat transfer; 3 leads

SOT89

1

2

3

UNIT

A

mm

1.6
1.4

0.48
0.35

c

0.44
0.37

D

4.6
4.4

E

2.6
2.4

HE

4.25
3.75

e

3.0

w

0.13

e1

1.5

L

min.

0.8

b2

b1

0.53
0.40

b3

1.8
1.4

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