Package outlines – Philips TDA8543 User Manual

Page 14

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1997 Jun 12

14

NXP Semiconductors

Product specification

2 W BTL audio amplifier

TDA8543

PACKAGE OUTLINES

UNIT

A

max.

1

2

b

1

c

E

e

M

H

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1

99-12-27
03-02-13

A

min.

A

max.

b

max.

w

M

E

e

1

1.40
1.14

0.055
0.045

0.53
0.38

0.32
0.23

21.8
21.4

0.86
0.84

6.48
6.20

0.26
0.24

3.9
3.4

0.15
0.13

0.254

2.54

7.62

0.3

8.25
7.80

0.32
0.31

9.5
8.3

0.37
0.33

2.2

0.087

4.7

0.51

3.7

0.15

0.021
0.015

0.013
0.009

0.01

0.1

0.02

0.19

050G09

MO-001

SC-503-16

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w

M

b

1

e

D

A

2

Z

16

1

9

8

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

(1)

(1)

D

(1)

Z

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

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