Philips TDA8943SF - Manual (Page 12)

© Philips Electronics N.V. 1999. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 14 April 1999 Document order number: 9397 750 04877
Contents
Philips Semiconductors
TDA8943SF
7 W mono BTL audio amplifier
1 General description. . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications. . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data. . . . . . . . . . . . . . . . . 1
5 Ordering information . . . . . . . . . . . . . . . . 2
5.1 Ordering options. . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information . . . . . . . . . . . . . . . . . 3
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . 4
8 Functional description . . . . . . . . . . . . . . . 4
8.1 Power amplifier. . . . . . . . . . . . . . . . . . . . . 4
8.2 Mode selection . . . . . . . . . . . . . . . . . . . . . 4
9 Limiting values . . . . . . . . . . . . . . . . . . . . . 5
10 Thermal characteristics . . . . . . . . . . . . . . 5
11 Static characteristics . . . . . . . . . . . . . . . . 5
12 Dynamic characteristics . . . . . . . . . . . . . . 6
13 Application information . . . . . . . . . . . . . . 6
14 Test information . . . . . . . . . . . . . . . . . . . . 7
14.1 Quality information . . . . . . . . . . . . . . . . . . 7
15 Package outline . . . . . . . . . . . . . . . . . . . . . 8
16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . 9
16.1 Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . 9
16.2 Soldering by dipping or by solder wave . . 9
16.3 Manual soldering . . . . . . . . . . . . . . . . . . . 9
16.4 Package related soldering information . . . 9
17 Revision history . . . . . . . . . . . . . . . . . . . . 9
18 Data sheet status. . . . . . . . . . . . . . . . . . . 10
19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . 10
20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . 10