Package outline – Philips BGX885N User Manual

Page 5

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2001 Nov 14

5

NXP Semiconductors

Product specification

860 MHz, 17 dB gain push-pull amplifier

BGX885N

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

DIMENSIONS (mm are the original dimensions)

SOT115D

0

5

10 mm

scale

Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads

SOT115D

D

U1

q

q1

b

F

S

A

Z

E

A2

L

c

d

Q

U2

M

w

7

8

9

2

3

W

e

e1

5

6

4

p

y

M

B

x

M

B

1

B

04-02-04
10-06-18

q2

y

M

B

UNIT

A2

max.

c

e

e1

q

Q

max.

q1

q2

U2

U1

W

mm

20.8

9.5

0.51
0.38

0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8

4.15
3.85

2.4

38.1 25.4 10.2 4.2

44.75
44.25

8.2
7.8

0.25

0.1

3.8

b

F

p

6-32

UNC

y

w

0.7

x

S

A

max.

D

max.

L

min.

E

max.

Z

max.

d

max.

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