NEC PD75P308 - Manual (Page 30)

µ
PD75P308
30
6. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
µ
PD75P308 be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document "Semiconductor
Devices Mounting Manual" (IEI-616).
The soldering methods and conditions are not listed here, consult NEC.
Table 6-1 Soldering Conditions
µ
PD75P308GF-3B9: 80-pin plastic QFP (14 x 20 mm)
Soldering Method Soldering Conditions
Symbol for Recommended
Condition
Wave Soldering Soldering bath temperature: 260 ° C max., WS60-162-1
time: 10 seconds max., number of times: 1,
pre-heating temperature: 120
°
C max. (package surface
temperature), maximum number of days: 2 days*,
(beyond this period, 16 hours of pre-baking is required
at 125
° C).
Infrared Reflow Package peak temperature: 230 ° C, IR30-162-1
time: 30 seconds max. (210
°
C min.),
number of times: 1, maximum number of days: 2 days*
(beyond this period, 16 hours of pre-baking is required
at 125
° C)
VPS Package peak temperature: 215 ° C, VP15-162-1
time: 40 seconds max. (200 ° C min.),
number of times: 1, maximum number of days: 2 days*
(beyond this period, 16 hours of pre-baking is required
at 125
° C)
Pin Partial Heating Pin temperature: 300 ° C max., —
time: 3 seconds max. (per side)
*: Number of days after unpacking the dry pack. Storage conditions are 25
°
C and 65%RH max.
Caution: Do not use two or more soldering methods in combination (except the pin partial heating
method).
★
A model that can be soldered under the more stringent conditions (infrared reflow peak
temperature: 235
°
C, number of times: 2, and an extended number of days) is also available.
For details, consult NEC.
Notice