Renesas FLASH Development Toolkit 3.07 - Manual (Page 129)

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13.2 Hardware Differences
The FDM had no capability of supplying the target power whereas the E8Direct can supply 3.3V or 5V and
the FDM-E8Direct pin usage is different. This means that it is not possible to simply swap an FDM for an
E8. The general purpose I/O pins on the FDM were labelled as MD0 to MD4 and FWE, and they had a
direct mapping with the mode pins with matching names on the target devices. Because the number of
available general purpose I/O pins is reduced on the E8, and the locations on the 14-pin header are
different, we can no longer have a direct mapping between device mode pin names and E8 I/O pins, so we
have chosen to label them as ‘A’, ‘B’, ‘C’ and ‘D’. The pin settings required for E8Direct will have to be
board specific rather than device specific.
FDM Pin Name
Pin
No.
14-pin connector 20-pin connector (Japan
only)
E8 Direct Pin Name
1 SCK / RES Output D
2 GND GND GND
3 FWx FWx Output C
4 MD0 GND Output A
5
Txd (Input from Txd of
Target device to Rxd of
2148AF on FDM)
MD0
Target Txd (Input from Txd
of Target device to Rxd0 of
2215UF on E8)
6 MD1 GND GND (Connected to GND on E8)
7 MD4 MD1 Output B
8 UVCC Input GND
UVCC (can supply 3.3 or 5V
or detect if target is
powered)
9 PVCC Input MD2 BUSY (Not used for E8Direct)
10 MD2 GND GND (Connected to GND on E8)
11
Rxd (Output to Rxd of
Target device from Txd0
of 2148AF on FDM)
MD3
Target Rxd (Output to Rxd of
Target device from Txd0 of
2215UF on E8)
12 MD3 GND GND (Connected to GND on E8)
13 RESET MD4 RESET
14 UCONNECT GND
UCONNECT (Connect to GND on
Target board)
15 -
RXD (TXD for the user
system)
-
16 - GND -
17 -
TXD (RXD for the user
system)
-
18 - VIN (Vcc or PVcc) -
19 - NC -
20 - VIN (PVcc) -