Chip information, Package information – Rainbow Electronics MAX13047E User Manual
Page 14

MAX13046E/MAX13047E
Single- and Dual-Bidirectional
Low-Level Translator
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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SPRINGER
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns, go
to
www.maxim-ic.com/packages
.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
6 µDFN
L611-1
10 UTQFN
V101A1CN-1