Rainbow Electronics W25X64 User Manual

Page 3

Advertising
background image

W25X16, W25X32, W25X64

Publication Release Date: June 28, 2006

- 3 - Preliminary - Revision B

11.2.4

Write Enable (06h)........................................................................................................18

11.2.5

Read Status Register (05h) ..........................................................................................19

11.2.6

Write Status Register (01h) ..........................................................................................20

11.2.7

Read Data (03h) ...........................................................................................................21

11.2.8

Fast Read (0Bh) ...........................................................................................................22

11.2.9

Fast Read Dual Output (3Bh) .......................................................................................23

11.2.10

Page Program (02h) ...................................................................................................24

11.2.11

Sector Erase (20h) .....................................................................................................25

11.2.12

Block Erase (D8h) ......................................................................................................26

11.2.13

Chip Erase (C7h) ........................................................................................................27

11.2.14

Power-down (B9h) ......................................................................................................28

11.2.15

Release Power-down / Device ID (ABh) .....................................................................29

11.2.16

Read Manufacturer / Device ID (90h) .........................................................................31

11.2.17

JEDEC ID (9Fh)..........................................................................................................32

12.

ELECTRICAL CHARACTERISTICS (PRELIMINARY) (4) ....................................................... 33

12.1

Absolute Maximum Ratings (1) .................................................................................... 33

12.2

Operating Ranges......................................................................................................... 33

12.3

Endurance and Data Retention .................................................................................... 34

12.4

Power-up Timing and Write Inhibit Threshold .............................................................. 34

12.5

DC Electrical Characteristics ........................................................................................ 35

12.6

AC Measurement Conditions........................................................................................ 36

12.7

AC Electrical Characteristics ........................................................................................ 37

12.8

AC Electrical Characteristics (cont’d) ........................................................................... 38

12.9

Serial Output Timing ..................................................................................................... 39

12.10

Input Timing................................................................................................................. 39

12.11

Hold Timing ................................................................................................................. 39

13.

PACKAGE SPECIFICATION .................................................................................................... 40

13.1

8-Pin SOIC 208-mil (Package Code SS)...................................................................... 40

13.2

8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 41

13.3

8-contact 6x5 WSON .................................................................................................... 42

13.4

8-contact 6x5 WSON Cont’d. ....................................................................................... 43

13.5

16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 44

14.

ORDERING INFORMATION

(1)

................................................................................................. 45

15.

REVISION HISTORY ................................................................................................................ 46

Advertising