Ucsp applications information, Chip information – Rainbow Electronics MAX9712 User Manual

Page 13

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MAX9712

500mW, Low EMI, Filterless,

Class D Audio Amplifier

______________________________________________________________________________________

13

tered output drives the SYNC input of the slave device
(U2), synchronizing the switching frequencies of the two
devices. Synchronizing two MAX9712s ensures that no
beat frequencies occur within the audio spectrum. This
configuration works when the master device is in either
FFM or SSM mode. There is excellent THD+N perfor-
mance and minimal crosstalk between devices due to
the SYNC connection (Figures 8 and 9). U2 locks onto
only the frequency present at SYNC, not the pulse
width. The internal feedback loop of device U2 ensures
that the audio component of U1’s output is rejected.

UCSP Applications Information

For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit
board techniques, bump-pad layout, and recommend-
ed reflow temperature profile, as well as the latest
information on reliability testing results, refer to the
Application Note: UCSPA Wafer-Level Chip-Scale
Package
available on Maxim’s website at www.maxim-
ic.com/ucsp.

Chip Information

TRANSISTOR COUNT: 3595

PROCESS: BiCMOS

Figure 7. Master-Slave Stereo Configuration

IN+

IN-

OUT+

OUT-

SYNC

1

µF

RIGHT-CHANNEL

DIFFERENTIAL

AUDIO INPUT

MAX9712

V

DD

V

DD

PV

DD

IN+

IN-

OUT+

OUT-

SYNC

1

µF

LEFT-CHANNEL

DIFFERENTIAL

AUDIO INPUT

MAX9712

V

DD

PV

DD

Figure 8. Master-Slave THD

100

0

0.1

0.2

0.3

0.4

0.5

10

1

0.1

0.01

0.001

TOTAL HARMONIC DISTORTION PLUS NOISE

vs. OUTPUT POWER

OUTPUT POWER (W)

THD+N (%)

V

DD

= 3.3V

f = 1kHz
R

L

= 8

SLAVE DEVICE

Figure 9. Master-Slave Crosstalk

0

-120

-100

10

100

1k

10k

100k

CROSSTALK vs. FREQUENCY

-80

FREQUENCY (Hz)

CROSSTALK (dB)

-60

-40

-20

MASTER-TO-SLAVE

SLAVE-TO-MASTER

V

DD

= 3.3V

R

L

= 8

f = 1kHz
V

IN

= 500mV

P-P

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