Bonding pad diagram – Rainbow Electronics W24L257 User Manual
Page 8
Preliminary W24L257
- 8 -
BONDING PAD DIAGRAM
23
X
Y
A14
A12
A7
A6
A5
A3
8
22
A2
A10
OEB
A11
A9
A8
WEB
V
DD
V
DD
7
A4
A13
1
2
3
4
5
29
24
25
26
27
6
30
28
11
12
13
15
16
17
18
A0
I/O0 I/O1 I/O2 V
SS
V
SS
I/O4 I/O5 I/O6
19
9
A1
10
20
CSB
14
21
I/O7
I/O3
AC5394
PAD NO.
X
Y
1 -232.25
1445.22
2 -351.70
1445.22
3 -471.15
1445.22
4 -590.60
1445.22
5 -710.05
1445.22
6 -829.50
1445.22
7 -992.79
1362.24
8 -992.79
-1306.11
9 -857.86
-1452.79
10 -738.41
-1452.79
11 -594.84
-1414.13
12 -451.06
-1414.13
13 -310.67
-1414.13
14 -171.78
-1405.28
15 24.45
-1405.28
16 151.80
-1414.13
17 298.07
-1414.13
18 443.28
-1414.13
19 588.20
-1414.13
20 732.84
-1414.13
21 871.11
-1452.79
22 992.75
-1312.15
23 992.75
1373.67
24 810.09
1445.22
25 690.64
1445.22
26 571.19
1445.22
27 451.74
1445.22
28 332.29
1445.22
29 120.25
1444.65
30 -93.23
1444.65
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to V
DD
or left floating in the PCB layout.