Rainbow Electronics W24L11 - Manual (Page 9)

Preliminary W24L11
Publication Release Date: October 1999
- 9 - Revision A1
PACKAGE DIMENSIONS
32-pin P-DIP
1. Dimensions D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 include mold mismatch and
are determined at the mold parting line.
6. General appearance spec. should be based on
final visual inspection spec.
1.37 1.22 0.054 0.048
Notes:
Symbol
Min. Nom. Max. Max. Nom. Min.
Dimension in inches Dimension in mm
A
B
c
D
e
A
L
S
A
A 1
2
E
0.050 1.27
0.210 5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.555 0.550 0.545 14.10 13.97 13.84
17.02
15.24 14.99 15.49 0.600 0.590 0.610
2.29 2.54 2.79 0.090 0.100 0.110
B
1
1
e
E
1
a
1.650 1.660 41.91 42.16
0 15
0.085 2.16
0.650 0.630 16.00 16.51
protrusion/intrusion.
4. Dimension B1 does not include dambar
5. Controlling dimension: Inches
15 0
Seating Plane
e A
2 A
a
c
E
Base Plane 1 A
1 e
L
A
S
1 E
D
1 B
B
32
1 16
17
32-pin SOP Wide Body
1
17 32
16
y
e
D
S
Seating Plane
b
A
A
E H
L
L
E
E 1
c
e 1
1 e
A 2
See Detail F
Detail F
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimensions D & E include mold mismatch
and determined at the mold parting line.
.
Notes:
4. Controlling dimension: Inches
5. General appearance spec should be based
on final visual inspection spec.
0.20 0.15 0.008 0.006
Symbol
Min. Nom. Max. Max. Nom. Min.
Dimension in Inches Dimension in mm
A
b
c
D
e
H
E
L
y
A
A
L
E
1
2
E
0.012 0.31
0.118 3.00
0.004
0.101
0.014
0.106
0.016
0.111
0.020
2.57
0.36
0.10
2.69
0.41
2.82
0.51
0.047
0.004
0 10
0.805
0.055
0.817
0.063 1.19
20.45
1.40
20.75
1.60
0.556 0.556 0.546 14.38 14.12 13.87
10 0
0.10
11.43 11.30 11.18 0.450 0.445 0.440
0.58 0.79 0.99 0.023 0.031 0.039
1.12 1.27 1.42 0.044 0.050 0.056
S 0.91 0.036
θ
θ