3 8u-4 — 8-ball wlcsp, Top view side view bottom view, 8u-4 b – Rainbow Electronics AT25DL081 User Manual
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AT25DL081 [DATASHEET]
8732D–DFLASH–12/2012
17.3
8U-4 — 8-ball WLCSP
DRAWING NO.
REV.
GPC
TITLE
8U-4
B
3/22/12
GFB
8U-4, 8-ball,
(4x2 Array) Wafer Level Chip Scale Package
(WLCSP) (637N6)
( UNIT OF MEASUREMENT - mm)
BALL COORDINANCE TABULATION
Top View
Side View
Bottom View
A
j
n
0.015
m
C
j
n
0.050
m
C A B
B
C
D
2
1
PIN A1
-A-
-B-
d
0.015 4X
0.500
1.887 MAX
3.038 MAX
1.500
0.500
PIN A1
CORNER
0.409 MAX
d
0.075
-C-
0.200±0.025
0.140 MIN
Ø0.290±0.0300
Ball Signal x-coord
y-coord
A2
CSBPAD
-0.250
0.750
A1
vdd!
0.250
0.750
B2
SOPAD
-0.250
0.250
B1
HLDBPAD
0.250
0.250
C2
WPBPAD
-0.250
-0.250
C1
SCKPAD
0.250
-0.250
D2
gnd!
-0.250
-0.750
D1
SIPAD
0.250
-0.750
2
1. Dimension of ball is measured at the maximum ball diameter
in a plane parallet to the seating plane.
2. Planarity applied to whole wafer.
Package Drawing Contact:
[email protected]